MPI LOGIC PROBE CARDS

MPi Logic Probe Cards

MPi Logic Probe Cards

Blog Article






Canteliver Probe Card

MPI Cantilever Probe Card is commonly applied on gold bump and pad wafer testing for Screen driver, logic, and memory unit. MPI’s cantilever probes are the corresponding remedy to the requires of fi­ne pitch, compact pad size, high velocity, considerably less cleaning, multi-DUT, higher pin depend, and ultra-low leakage requirements. With outstanding craftsmanship, revolutionary architecture and confirmed methodologies based upon mechanical and electrical simulation/measurement final results, earning MPI the top cantilever service provider worldwide.


FCB Probe Card

The FCB Probe Card is the most mature technological innovation of buckling beam probe card. It can be aimed to obtain the semiconductor ship manufacture time-to-industry (TTM) and value of exam (COT) need. FCB is really a established Resolution for a number of semiconductor manufacturing exams from early engineering pilot-runs to higher volume manufacturing (HVM). FCB is ready for unit requiring significant signal integrity probing (SI) and/or electrical power integrity probing (PI). Applications include slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB ensures the world’s greatest overall Value-of-ownership (COO) for various DUT applications.


EVS Probe Card

The EVS Probe Card is definitely an enhancement over the conventional buckling beam probe card. Important functions are larger current carrying ability (C.C.C.) and decrease balanced Call drive (BCF), and Over-all MEMS-like qualities. EVS can certainly satisfy the requirement of Highly developed wafer probing. Specific alignment and great planarity Management will be the important things contributing to steady contact resistance. With its potential and general performance, EVS Probe Card is an excellent option for Innovative probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s Remedy to demand from customers for ever finer pitch. It can be designed for more compact Al pad, and is perfect for little pitch software here with peripheral and total array sample. With specific alignment and better planarity Management, Osprey can arrive at larger productiveness by multi-DUT structure.  The forming wire (FW) kind needle generated with MPI’s own micro fabrication method not simply provides high-top quality effectiveness but will also enables straightforward needle alternative and shortens retaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle which happens to be suitable for the demand from customers of minimal pressure probing. It also comes along with a chance to fulfill significant C.C.C. and substantial pin counts application. The MEMS method assures very regular needle attributes, plus the special framework design and style allows specific alignment and planarity Handle.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

Report this page